SAC1115—SAC1120

SAC1115—SAC1120

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SAC1115 Quartz Substrate Passive Components

 

Index

Number

Freq

GHz

Insertion

Loss(dB)(typ.)

Description Chip Size

(mm)

SAC1115

28~30 0.6 3dB,90°Integrated absorption resistance 2.9×3.5×0.25

SAC1116

34~36 0.6 3dB,90°Integrated absorption resistance 2.65×3.3×0.25
SAC1117 32~37 0.7 3dB,90°

4×5×0.25

SAC1118 26~33 0.7 3dB,90°

5.9×5.6×0.25

SAC1119 38~45 1 3dB,90°

3.85×5×0.25

SAC1120 40~50 1.2 3dB,90°

3.35×4.5×0.25

Feature

  • Fabricated with semiconductor photo process
  • Compatible with micro-assembly process
  • Accurate exterior dimension
  • Highly Repeatability from batch to batch

Typical Applications Power splitter
Power combiner
Microwave hybrid integrated components

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